LANmark-OF ENSPACE METHOD B MTP/M-MTP/M Pre-Term MM 24c Low Loss LSZH xxxM OM5 Lime Green

Pre-Term for data centres, buildings and campus based on Micro-Bundle Universal

The cable has a small diameter and bend raduis to meet data centre requirements.

Fire performance

The cables have been tested for fire performance according to IEC 60332-3c. The cable meets LSZH requirements.

MTP*-MTP Pre-Term characteristics

The MTP-MTP Pre-Term has standard pinned (male) connectors. This matches with the un-pinned (female) connectors in the ENSPACE modules and the female Plug&Play modules.

In order to reduce overlengths in data centers the Pre-Terms are custom made and available with 1m increments. The "xxx" in the N-number is the length in metre between the cable glands, i.e. the Pre-Term length between the back side of the patch panels.

The Pre-Terms are optimized for both pulling and laying in data centers. On both sides the MTP connectors are protected by a bubble foam. The maximum pulling force on the pulling eye is 450N. The detachable pulling eye with corrugrated tube can be ordered using PN N890.100HP.

The MTP-MTP Pre-Terms come with a PG-13 cable gland that fits into the LANmark-OF ENSPACE and Plug&Play patch panel slots.

Optical Performance and Polarity

The insertion loss for a multimode the MTP-MTP* connection has Low Loss performance: typical insertion loss is 0,15 dB with a maximum of 0,35 dB insertion loss. Ultra Low loss is also available with typical insertion loss 0.125dB with a maximum of 0.25dB insertion loss.

The insertion loss for a singlemode the MTP-MTP* connection has Low Loss performance:  typical insertion loss 0.3dB with a maximum of 0.35dB insertion loss.

The insertion loss of a MTP-MTP* connection is measured according to standard IEC61300-3-45.

The minimum return loss for a multimode MTP connection is 20 dB measured according to IEC 61300-3-6. The minimum return loss for a singlemode MTP connection is 45 dB measured according to IEC 61300-3-6.

The method B Pre-Term has a key up / key up design. This is in agreement with standard TIA-568.3-D-2016 method B.